Yongbin WeiVice President, Engineering at Qualcomm
Dr. Yongbin Wei is currently VP of Engineering with Wireless R&D. Yongbin has been leading new technology development over the years on system design, standardization and product development for cdma2000, LTE, and recently cutting-edge 5G NR technology for industrial IoT and spectrum sharing. He holds more than 350 US issued patents. Yongbin received bachelor’s and master’s degrees from University of Science and Technology of China, and Ph.D. degree from Purdue University, all in Electrical Engineering.