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Mark Karasek

Executive Vice President of Engineering & Chief Technology Officer at Chamberlain Group


Mark Karasek is Executive Vice President of Engineering and Chief Technology Officer of The Chamberlain Group, a midsize corporation with 4000 employees worldwide and a global leader in the Access and Security markets.  The company delivers innovative connected products and services in the residential and commercial garage door opener and vehicle access categories, and is a recognized leader in the emerging IoT space.  Mark joined The Chamberlain Group in 1994 and has held various technical leadership roles in the company.  Prior to joining Chamberlain, he held engineering positions at Illinois Tool Works, The Applied Research Laboratory at The Pennsylvania State University, and Wilson Sporting Goods. 

Mark is a Senior Fellow of The Kellogg Innovation Network, an industry group focused on innovation best practices.  He is active in the Chicago startup community as a mentor at the software accelerator 1871 and as a board member of mHUB, an innovation center focused on product based startups and manufacturing technology.  He is also on the advisory boards of the Masters of Product Design and Development Program at Northwestern University and Data Science, a data analytics start-up located in Los Angeles.  Mark is a Distinguished Fellow and past President of the National Knowledge and Intellectual Property Management Taskforce, a consortium of companies focused on intellectual property management.  He has been active in the not-for-profit community, serving as an elected member of the local school board, participating in various church and community committees, and providing strategic planning consultation to several non-profit organizations.  Mark received a BS in Engineering Mechanics and an MS in Mechanical Engineering from the University of Illinois, and a PhD in Polymer Science from the Pennsylvania State University.  He has served on the Alumni Advisory Board of the Mechanical Science and Engineering Department at the University of Illinois.